Qualcomm launches FastConnect 8800: The world's first Wi-Fi 8 chip to achieve speeds of 30 Gbps.
At MWC 2026, Qualcomm unveiled the FastConnect 8800 chip, which supports Wi-Fi 8, and the Snapdragon X105 5G modem, setting a new standard for speed and connectivity performance.
At MWC 2026, Qualcomm officially announced two of its most advanced wireless solutions: the FastConnect 8800 chip supporting Wi-Fi 8 and the Snapdragon X105 5G Modem-RF system. These are significant advancements aimed at delivering ultra-fast and stable connectivity experiences for future generations of mobile devices, laptops, and IoT systems.
FastConnect 8800: The era of Wi-Fi 8 with breakthrough speeds.
FastConnect 8800 is expected to be the fastest and longest-range Wi-Fi device on the market today. While maintaining compatibility with Wi-Fi 7 features, Qualcomm is promoting this solution as Wi-Fi 8 due to its significant technical improvements, allowing for maximum speeds of up to 30 Gbps.
The strength of the FastConnect 8800 lies in its HBS (High Band Simultaneous) Multi-Link technology. This technology allows devices to simultaneously use two frequency bands, 5GHz or 6GHz, to increase bandwidth and minimize latency. In addition, the chip is equipped with Bluetooth 5.5 (some sources indicate support for Bluetooth 7), supporting next-generation audio standards to optimize quality for wireless headphones and speakers.
Snapdragon X105: 5G modem with integrated AI and energy optimization.
Alongside the Wi-Fi solution, the Snapdragon X105 5G Modem-RF system was also launched to enhance mobile network connectivity. This solution places particular emphasis on energy efficiency and a compact design, making it easy to integrate into a wide range of devices, from smartphones to industrial IoT applications.
A notable feature of the Snapdragon X105 is its advanced antenna tuning capabilities combined with AI features. Artificial intelligence will be responsible for optimizing network performance and intelligent power management, helping devices maintain stable connections even in weak signal conditions while still conserving battery power.
Typical specifications of the new chip series.
| Features | FastConnect 8800 | Snapdragon X105 |
|---|---|---|
| Connection standard | Wi-Fi 8, Bluetooth 5.5/7 | 5G Modem-RF |
| Maximum speed | 30 Gbps | Optimized for 5G infrastructure |
| Core technology | HBS Multi-Link | AI Antenna Tuning |
| Design objectives | Speed and range | Performance and energy efficiency |
Both of Qualcomm's new chip lines aim to deliver a superior wireless experience, enhancing speed and connectivity efficiency for the global technology ecosystem. These solutions are expected to appear in flagship products in the near future.