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semiconductor technology
Latest news related to semiconductor technology.
Huawei announces 3D LogicFolding technology: Ambitious goal to produce 1.4 nm chips by 2031.
Huawei introduces 3D LogicFolding technology and Tau Extension Law to achieve a transistor density of 1.4 nm by 2031, overcoming the barriers of lithography machines.
Technology
Xiaomi XRING O2 chip revealed: Breakthrough 2nm process and ambitions for technological self-reliance.
Xiaomi is developing the XRING O2 processor, based on an advanced 2nm process. This chip promises superior performance and cost-effectiveness compared to leading competitors from...
Xiaomi XRING O2: A new step in the Chinese giant's 3nm chip self-reliance strategy.
Following the XRING O1, Xiaomi is about to launch the XRING O2 processor, built on a 3nm process, to reduce its dependence on Qualcomm and MediaTek and strengthen its own technology ecosystem.
AMD RDNA 5 revealed: Manufactured on TSMC N3P process and launching in 2027.
AMD's next-generation RDNA 5 graphics chip has completed its tape-out phase on TSMC's N3P process and is expected to be officially launched in mid-2027.
China develops its own EUV lithography machines: Challenging ASML's position.
China has successfully developed its first prototype EUV lithography machine, a significant step forward in the semiconductor race. However, the device is not yet complete and is expected to take until...
Prime Minister: We hope international friends will support Vietnam in transitioning to a new stage of development.
The Prime Minister stated that Vietnam is committed to rapid and sustainable development based on science and technology, innovation, and digital transformation, especially in emerging sectors such as AI and the semiconductor industry.
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