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Huawei phát triển công nghệ Logic Folding nhằm bắt kịp tiến trình 1.4nm của TSMC

Huawei is developing Logic Folding technology to catch up with TSMC's 1.4nm process.

Huawei's Logic Folding solution helps increase transistor density through 3D chip stacking techniques, paving the way for competition with TSMC's 1.4nm process by 2031.
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